On October 14, held in Chengdu, The Seventh College Students’ Integrated Circuit Design and Application Innovation Contest ended. Two participating teams, from Integrated Circuit Design and Integrated System Major of DNUI, won the Grand Prize of "Era Core of the Enterprise Cup" and the first prize of "Chipone Technology (Beijing) Co, Ltd. Enterprises Cup" respectively.
This year, nine participating teams of DNUI won prizes in the contest held in North China Division in July, of which two teams won the first and second prize respectively in North China Division and advanced to the finals. They will compete with other 141 teams from another five national divisions. At last, in the finals held in Chengdu, under the guidance of Teacher Zhang Yongfeng, Jiang Hao, a student of Grade 2015 and Liu Liangliang, a student of Grade 2013 of IC Design and Integrated System Major, and Li Tianjia, a student of Grade 2014 of Microelectronics Science and Engineering major, won the Grand Prize of Era Core Enterprise Cup, and got the prize of 10,000 yuan for their work "The Algorithm Development of BeiDou Satellite Navigation Receiver Chip"; Under the guidance of teacher Cong Guotao, Sun Yuan, Wang Kaihui, and Jia Yingying, students of Grade 2014 of Integrated Circuit Design and Integrated System, won the first prize of “Chipone Technology (Beijing) Co, Ltd. Enterprise Cup" with their work “Data Conversion System"
The Contest was a national event, co-hosted by Beijing Institute of Electronics with IEEE under the guidance of Talent Exchange Center of the Ministry of Industry and Information Technology and Ministry of Education of Electronics and Engineering Steering Committee. The Contest actively respond to the entrepreneurship national education strategy of creating double-integrated circuits. It was a top contest for college students, graduate students in the field of domestic Integrated Circuit. The contest lasted six months and attracted 550 teams with 1600 participants from 104 colleges and universities, including Tsinghua University, Institute of Microelectronics of Chinese Academy of Sciences, Beijing University of Aeronautics and Astronautics, Xi'an Jiaotong University, Nankai University, Shanghai Jiaotong University, and other institutions.